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? product structure: silicon monolithic integrated circuit ? this product is not designed prot ection against radioactive rays. . 1/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 tsz22111 ? 14 ? 001 www.rohm.com datashee t 500-ma 3.3-v or 5.0-v output ldo regulators bd4xxm5-c series general description the bd4xxm5 series are low quiescent regulators featuring 45 v absolute maximum voltage, and output voltage accuracy of 2 % (3.3 v or 5 v: typ.), 500 ma output current and 38 a (typ.) current consumption. these regulators are therefor e ideal for applications requiring a direct connection to the battery and a low current consumption. a logical high at the ctl enables the device and low at the ctl disables the device. (only w: includes enable input). ceramic capacitors can be used for compensation of the output capacitor phase. furthermore, these ics also feature overcurrent protection to protect the device from damage caused by short-circ uiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. package w (typ.) d (typ.) h (max.) fpj: to252-j5 6.60 mm 10.10 mm 2.38 mm fp: to252-3 6.50 mm 9.50 mm 2.50 mm features ? qualified for automotive applications ? wide temperature range (tj): -40 c to +150 c ? wide operating input range: 3.0 v to 42 v ? low quiescent current: 38 a (typ.) ? output current: 500 ma ? high output voltage accuracy: 2 % ? output voltage: 3.3 v or 5.0 v (typ.) ? enable input (only w) ? overload current protection (ocp) ? thermal shutdown protection (tsd) ? aec-q100 qualified (note1) (note1:grade1) fp2: to263-5 10.16 mm 15.10 mm 4.70 mm fp2: to263-3 10.16 mm 15.10 mm 4.70 mm figure 1. package outlook applications automotive (body, audio system, navigation system, etc.) typical application circuits components externally connected: 0.1 f cin, 10 f cout (typ.) * electrolytic, tantalum and ceramic capacitors can be used. figure 2. typical application circuits bd433 / 450m5wfpj-c bd433 / 450m5wfp2-c bd433 / 450m5fp-c bd433 / 450m5fp2-c downloaded from: http:///
datasheet d a t a s h e e t 2/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series ordering information b d 4 x x m 5 w f p j c z e 2 part number output voltage 33: 3.3 v 50: 5.0 v output current 5: 500 ma enable input w: includes enable input package fpj: to252-j5 fp : to252-3 fp2: to263-5 to263-3 packaging and forming specification z: manufacturing code e2: embossed tape and reel lineup output current ability output voltage (typ.) enable input (1) package type orderable part number 500 ma 3.3 v to252-j5 bd433m5wfpj-ce2 to263-5 bd433m5wfp2-ce2 to252-3 bd433m5fp-ce2 to263-3 bd433m5fp2-ce2 5.0 v to252-j5 bd450m5wfpj-ce2 to263-5 BD450M5WFP2-Ce2 to252-3 bd450m5fp-ce2 to263-3 bd450m5fp2-ce2 (1) : includes enable input C : not includes enable input downloaded from: http:///
datasheet d a t a s h e e t 3/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series pin configurations figure 3. pin configuration pin descriptions bd433 / 450m5wfpj-c bd433 / 450m5wfp2-c pin no. pin name function pin no. pin name function 1 vcc supply voltage input pin 1 vcc supply voltage input pin 2 ctl output control pin 2 ctl output control pin 3 gnd ground pin 3 gnd ground pin 4 n.c. not connected 4 n.c. not connected 5 vout output pin 5 vout output pin 6 (fin) gnd ground pin 6 (fin) gnd ground pin bd433 / 450m5fp-c bd433 / 450m5fp2-c pin no. pin name function pin no. pin name function 1 vcc supply voltage input pin 1 vcc supply voltage input pin 2 n.c. not connected 2 gnd ground pin 3 vout output pin 3 vout output pin 4 (fin) gnd ground pin 4 (fin) gnd ground pin * n.c. pin is recommended to short with gnd. * n.c. pin can be open because it isnt connected it inside of ic. to252-j5 (top view) to263-5 (top view) fin 1 2 3 to252-3 (top view) 1 2 3 to263-3 (top view) 3 1 2 4 5 fin 3 1 2 4 5 downloaded from: http:///
datasheet d a t a s h e e t 4/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series block diagrams bd433 / 450m5wfpj-c bd433 / 450m5wfp2-c downloaded from: http:///
datasheet d a t a s h e e t 5/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series bd433 / 450m5fp-c bd433 / 450m5fp2-c figure 4. block diagrams prereg n.c. (2pin) gnd (fin) vcc (1pin) tsd vref driver ocp vout (3pin) downloaded from: http:///
datasheet d a t a s h e e t 6/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series description of blocks block name function description of blocks ctl (1) control output voltage on/off a logical high ( 2.8 v ) at the ctl enables the device and low ( 0.8 v ) at the ctl disable the device. prereg internal power supply power supply for internal circuit tsd thermal shutdown protection to protect the device from overheating. if the chip temperature ( tj ) reaches ca. 175 c ( typ. ), the output is turned off. vref reference voltage generate the reference voltage driver output mos fet driver drive the output mos fet ocp over current protection to protect the device from damage caused by over current. if the output current reaches ca. 900 ma (typ.), the output is turned off. (1) applicable for product with enable input. downloaded from: http:///
datasheet d a t a s h e e t 7/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series absolute maximum ratings parameter symbol ratings unit supply voltage (1) vcc -0.3 to +45.0 v output control voltage (2) ctl -0.3 to +45.0 v output voltage vout -0.3 to +8.0 v junction temperature range tj -40 to +150 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c esd withstand voltage (hbm) (3) v esd, hbm 2000 v (1) do not exceed pd. (2) applicable for product with enable input. the start-up orders of power supply (vcc) and the ctl do not influence if the voltage is within the operation power supply volt age range. (3) esd susceptibility human body model hbm. operating conditions (-40 c tj +150 c) parameter symbol min. max. unit supply voltage ( iout 500 ma ) (1) vcc 5.9 42.0 v supply voltage ( iout 250 ma ) (1) vcc 5.5 42.0 v supply voltage ( iout 500 ma ) (2) vcc 4.6 42.0 v supply voltage ( iout 250 ma ) (2) vcc 4.0 42.0 v output control voltage (3) ctl 0 42.0 v start-up voltage (4) vcc 3.0 C v output current iout 0 500 ma junction temperature range tj -40 +150 c (1) bd450m5wfpj-c / bd450m5wfp 2-c / bd450m5fp-c / bd450m5fp2-c (2) bd433m5wfpj-c / bd433m5wfp 2-c / bd433m5fp-c / bd433m5fp2-c (3) applicable for product with enable input. (4) when iout = 0 ma notice: please consider that the output voltage would be dropped (dropout voltage) according to the output current. downloaded from: http:///
datasheet d a t a s h e e t 8/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series thermal impedance (1) parameter symbol typ. unit conditions to252-j5 / to252-3 junction to ambient ja 136 c / w 1s (2) 23 c / w 2s2p (3) junction to top center of case (4) jt 17 c / w 1s (2) 3 c / w 2s2p (3) to263-5 / to263-3 junction to ambient ja 81 c / w 1s (2) 21 c / w 2s2p (3) junction to top center of case (4) jt 8 c / w 1s (2) 2 c / w 2s2p (3) (1) the thermal impedance is based on jesd51 - 2a (still-air) standard. (2) jesd51 - 3 standard fr4 114.3 mm 76.2 mm 1.57 mm 1-layer (1s) (top copper foil: rohm recommended footpr int + wiring to measure, 2 oz. copper.) (3) jesd51 -5 / -7 standard fr4 114.3 mm 76.2 mm 1.60 mm 4-layer 2s2p (top copper foil: rohm recommended footprint + wiring to measur e / 2 inner layers copper foil area of pcb: 74.2 mm 74.2 mm, copper (top & reverse side / inner layers) 2oz. / 1oz.) (4) t t : top center of cases (mold) temperature downloaded from: http:///
datasheet d a t a s h e e t 9/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series electrical characteristics unless otherwise specified, -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (1) , iout = 0 ma the typical value is defined at tj = 25 c. parameter symbol limit unit conditions min. typ. max. shut down current ishut (1) C 2.0 5.0 a ctl = 0 v tj 125 c circuit current icc C 38 95 a iout = 0 ma tj 125 c C 38 175 a iout 500 ma tj 150 c output voltage vout (2) 4.90 5.00 5.10 v 6 v vcc 42 v, 0 ma iout 400 ma 4.80 5.00 5.10 v 6 v vcc 42v 0 ma iout 500 ma vout (3) 3.23 3.30 3.37 v 6 v vcc 42 v 0 ma iout 400 ma 3.20 3.30 3.37 v 6 v vcc 42 v 0 ma iout 500 ma dropout voltage ? vd (2) C 0.20 0.50 v vcc = vout 0.95 (typ. 4.75 v) iout = 300 ma ? vd (3) C 0.25 0.75 v vcc = vout 0.95 (typ. 3.135 v) iout = 300 ma ripple rejection r.r. 55 60 C db f = 120 hz, ein = 1 vrms iout = 100 ma line regulation reg.i C 10 30 mv 8 v vcc 16 v load regulation reg.l C 10 30 mv 10 ma iout 400 ma thermal shut down tsd C 175 C c tj at tsd on (1) applicable for product with enable input. (2) for bd450m5wfpj-c / BD450M5WFP2-C / bd450m5fp-c / bd450m5fp2-c (3) for bd433m5wfpj-c / bd433m5wfp2-c / bd433m5fp-c / bd433m5fp2-c electrical characteristics ( enable function * applicable for product with enable input. ) unless otherwise specified, -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma. the typical value is defined at tj = 25 c. parameter symbol limit unit conditions min. typ. max. ctl on mode voltage vthh 2.8 C C v active mode ctl off mode voltage vthl C C 0.8 v off mode ctl bias current ictl C 15 30 a ctl = 5 v downloaded from: http:///
datasheet d a t a s h e e t 10/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series typical performance curves bd433m5wfpj-c / bd433m5wfp2-c / bd433m5fp-c / bd433m5fp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (1) , iout = 0 ma. (1) applicable for product with enable input. 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 45 circuit current: icc [a] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 012345678910 circuit curent: icc [a] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 0123456 output voltage: vout [v] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout [v] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c figure 5. circuit current vs. power supply voltage figure 6. output voltage vs. power supply voltage (iout = 0 ma) figure 7. circuit current vs. power supply voltage *magnified figure 5. at low supply voltage figure 8. output voltage vs. power supply voltage (iout = 0 ma) * magnified figure 6. at low supply voltage downloaded from: http:///
datasheet d a t a s h e e t 11/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 50 100 150 200 250 300 350 400 450 500 dropout voltage: ? vd [v] output current: iout [m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 0.01 0.1 1 10 100 ripple rejection: r.r. [db] frequency: f [khz] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 0 100 200 300 400 500 600 700 800 900 1000 output voltage: vout [v] output current: iout [m a] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd433m5wfpj-c / bd433m5wfp2-c / bd433m5fp-c / bd433m5fp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (1) , iout = 0 ma. (1) applicable for product with enable input. 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout [v] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c figure 10. output voltage vs. load (over current protection) figure 9. output voltage vs. power supply voltage (iout = 10 ma) figure 11. dropout voltage (vcc = 3.135 v) figure 12. ripple rejection (ein = 1 vrms, iout = 100 ma) downloaded from: http:///
datasheet d a t a s h e e t 12/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 6 100 120 140 160 180 200 output voltage: vout [v] junction temperature: tj [c] 3.230 3.250 3.270 3.290 3.310 3.330 3.350 3.370 -40-20 0 20406080100120140160 output voltage: vout [v] junction temperature: tj [c] 0 10 20 30 40 50 60 70 80 90 0 100 200 300 400 500 circuit current: icc [ a] output current: iout [m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 -40 0 40 80 120 160 circuit current: icc [ a] junction temperature: tj [c] typical performance curves bd433m5wfpj-c / bd433m5wfp2-c / bd433m5fp-c / bd433m5fp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5 v (1) , iout = 0 ma. (1) applicable for product with enable input. figure 13. circuit current vs. output current figure 14. output voltage vs. temperature (thermal shut down) figure 15. output voltage vs. temperature fi gure 16. circuit current vs. temperature downloaded from: http:///
datasheet d a t a s h e e t 13/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 6 012345 output voltage: vout [v] ctl supply voltage: ctl [v] tj = -40 c 0 1 2 3 4 5 6 012345 output voltage: vout [v] ctl supply voltage: ctl [v] tj = 25 c 0 1 2 3 4 5 6 012345 output voltage: vout [v] ctl supply voltage: ctl [v] tj = 125 c typical performance curves bd433m5wfpj-c / bd433m5wfp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 45 shut down current: ishut [ a] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c figure 17. shut down current vs. power supply voltage (ctl = 0 v) figure 18. ctl on / off mode voltage (tj = -40 c) figure 19. ctl on / off mode voltage (tj = 25 c) figure 20. ctl on / off mode voltage (tj = 125 c) downloaded from: http:///
datasheet d a t a s h e e t 14/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 -40 0 40 80 120 160 shutdown current: ishut [a] junction temperature: tj [c] typical performance curves bd433m5wfpj-c / bd433m5wfp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma 0 5 10 15 20 012345 ctl bias current: ictl [a] ctl supply voltage: ctl [v] tj = -40 c tj = 25 c tj = 125 c figure 21. shut down current (ctl = 0 v) figure 22. ctl bias current vs. ctl supply voltage downloaded from: http:///
datasheet d a t a s h e e t 15/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout [v] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 45 circuit current: icc [a] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd450m5wfpj-c / BD450M5WFP2-C / bd450m5fp-c/bd450m5fp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5v (1) , iout = 0 ma (1) applicable for product with enable input. 0 10 20 30 40 50 60 70 80 90 100 012345678910 circuit current: icc [a] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c 0 1 2 3 4 5 6 0123456 output voltage: vout [v] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c figure 23. circuit current vs. power supply voltage figure 24. output voltage vs. power supply voltage (iout = 0 ma) figure 25. circuit current vs. power supply voltage *magnified figure 23. at low supply voltage figure 26. output voltage vs. power supply voltage (iout = 0 ma) *magnified figure 24. at low supply voltage downloaded from: http:///
datasheet d a t a s h e e t 16/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 output voltage: vout [v] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 50 100 150 200 250 300 350 400 450 500 dropout voltage: ? vd [v] output current: iout [m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 0.01 0.1 1 10 100 ripple rejection: r.r. [db] frequency: f [khz] tj = -40 c tj = 25 c tj = 125 c typical performance curves bd450m5wfpj-c / BD450M5WFP2-C / bd450m5fp-c / bd450m5fp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5v (1) , iout = 0 ma (1) applicable for product with enable switch. figure 28. output voltage vs. output current (over current protection) figure 27. output voltage vs. power supply voltage (iout = 10 ma) figure 29. dropout voltage (vcc=4.75v) figure 30. ripple rejection (ein = 1 vrms, iout = 100 ma) 0 1 2 3 4 5 6 0 100 200 300 400 500 600 700 800 900 1000 output voltage: vout [v] output current: iout [m a] tj = -40 c tj = 25 c tj = 125 c downloaded from: http:///
datasheet d a t a s h e e t 17/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 6 100 120 140 160 180 200 output voltage: vout [v] junction temperature: tj [c] 4.900 4.920 4.940 4.960 4.980 5.000 5.020 5.040 5.060 5.080 5.100 -40-20 0 20406080100120140160 output voltage: vout [v] junction temperature: tj [c] 0 10 20 30 40 50 60 70 80 90 0 100 200 300 400 500 circuit current: icc [ a] output current: iout [m a] tj = -40 c tj = 25 c tj = 125 c 0 10 20 30 40 50 60 70 80 90 100 -40 0 40 80 120 160 circuit current: icc [ a] junction temperature: tj [c] typical performance curves bd450m5wfpj-c / BD450M5WFP2-C / BD450M5WFP2-C / bd450m5fp-c / bd450m5fp2-c reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, ctl = 5v (1) , iout = 0 ma (1) applicable for product with enable input. figure 31. circuit current vs. output current figure 32. output voltage vs. temperature (thermal shut down) figure 33. output voltage vs. temperature fi gure 34. circuit current vs. temperature downloaded from: http:///
datasheet d a t a s h e e t 18/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 6 012345 output voltage: vout [v] ctl supply voltage: ctl [v] tj = -40 c 0 1 2 3 4 5 6 012345 output voltage: vout [v] ctl supply voltage: ctl [v] tj = 25 c 0 1 2 3 4 5 6 012345 output voltage: vout [v] ctl supply voltage: ctl [v] tj = 125 c typical performance curves bd450m5wfpj-c / BD450M5WFP2-C reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 45 shut down current: ishut [ a] supply voltage: vcc [v] tj = -40 c tj = 25 c tj = 125 c figure 35. shut down current vs. power supply voltage (ctl = 0 v) figure 36. ctl on / off mode voltage (tj = -40 c) figure 37. ctl on / off mode voltage (tj = 25 c) figure 38. ctl on / off mode voltage (tj = 125 c) downloaded from: http:///
datasheet d a t a s h e e t 19/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 0 1 2 3 4 5 -40 0 40 80 120 160 shutdown current: ishut [a] junction temperature: tj [c] typical performance curves bd450m5wfpj-c / BD450M5WFP2-C reference data unless otherwise specified: -40 c tj +150 c, vcc = 13.5 v, iout = 0 ma 0 5 10 15 20 012345 ctl bias current: ictl [a] ctl supply voltage: ctl [v] tj = -40 c tj = 25 c tj = 125 c figure 39. shut down current vs. temperature (ctl = 0 v) figure 40. ctl bias current vs. ctl supply voltage downloaded from: http:///
datasheet d a t a s h e e t 20/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 4.7 f 10 f 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c 1vrms iout 4.7 f1 0 f 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c iout 4.7 f1 0 f 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c 4.7 f1 0 f 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c 4.7 f1 0 f 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c 4.7 f1 0 f 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c measurement circuit for typical performance curves (bd433 / 450m5wfpj-c) measurement setup for figure 5, 7, 16, 17, 21, figure 23, 25, 34, 35, 39 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 9, 27 measurement setup for figure 10, 28 measurement setup for figure 11, 29 measurement setup for figure 12, 30 measurement setup for figure 22, 40 measurement setup for figure 18, 19, 20, figure 36, 37, 38 measurement setup for figure 13, 31 downloaded from: http:///
datasheet d a t a s h e e t 21/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series measurement circuit for typical performance curves (bd433 / 450m5wfp2-c) 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 4.7 f 10 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c iout 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c iout 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 1vrms iout 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 4.7 f1 0 f 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c 4.7 f1 0 f measurement setup for figure 5, 7, 16, 17, 21, figure 23, 25, 34, 35, 39 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 9, 27 measurement setup for figure 10, 28 measurement setup for figure 11, 29 measurement setup for figure 12, 30 measurement setup for figure 22, 40 measurement setup for figure 18, 19, 20, figure 36, 37, 38 measurement setup for figure 13, 31 downloaded from: http:///
datasheet d a t a s h e e t 22/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 4.7 f 10 f 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c 4.7 f 10 f 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c 4.7 f1 0 f iout 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c 4.7 f1 0 f 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c 1vrms iout 4.7 f 10 f 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c 4.7 f 10 fiout 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c measurement circuit for typical performance curves (bd433 / 450m5fp-c) 4.7 f1 0 f 1: vcc 2: n.c. 3: vout fin bd4xxm5fp-c measurement setup for figure 5, 7, 16, figure 23, 25, 34 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 9, 27 measurement setup for figure 10, 28 measurement setup for figure 11, 29 measurement setup for figure 12, 30 measurement setup for figure 13, 31 downloaded from: http:///
datasheet d a t a s h e e t 23/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series measurement circuit for typical performance curves (bd433 / 450m5fp2-c) 4.7 f 10 f fin 2: gnd bd4xxm5fp2-c 1: vcc 3: vout 4.7 f1 0 f iout fin 2: gnd bd4xxm5fp2-c 1: vcc 3: vout 4.7 f1 0 f fin 2: gnd bd4xxm5fp2-c 1: vcc 3: vout 4.7 f fin 2: gnd bd4xxm5fp2-c 1: vcc 3: vout 10 f 1vrms iout 4.7 f1 0 f fin 2: gnd bd4xxm5fp2-c 1: vcc 3: vout measurement setup for figure 5, 7, 16, figure 23, 25, 34 measurement setup for figure 6, 8, 14, 15, figure 24, 26, 32, 33 measurement setup for figure 9, 27 measurement setup for figure 10, 28 measurement setup for figure 11, 29 measurement setup for figure 12, 30 measurement setup for figure 13, 31 downloaded from: http:///
datasheet d a t a s h e e t 24/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series selection of components externally connected ? vcc insert capacitors with a capacitance of 0.1 f or higher between the vcc and the gnd. choose the capacitance according to the line between the powe r smoothing circuit and the vcc. select ion of the capacit ance also depends on the application. verify the application and allow su fficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. ? output pin capacitor in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd. we recommend using a capacitor with a capacitance of 10 f (typ.) or higher. electrolytic, t antalum and ceramic capacitors can be used. when selecting the capacitor en sure that the c apacitance of 6 f or higher is maintained at the intended applied voltage and temperature range. due to changes in temperature the capacitors capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the data of figure 41. the stable operation range given in the data of figure 41 and figure 42 is based on the standalone ic and resistive load. for actual applications the st able operating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verifica tion of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend usi ng x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly fluctuation of input voltage a nd load current, select the capacitance in accordance with verifying that the actual application meets with the require d specification. m ount the capacitor as much as possible near connected pin. measurement setup fin 2: gnd bd4xxm5fp2-c 1: vcc 3: vout cin cout esr 1: vcc 3: gnd 5: vout 2: ctl 4: n.c. fin bd4xxm5wfp2-c cin cout esr 1: vcc 3: n.c. 5: vout fin 2: ctl 4: n.c. bd4xxm5wfpj-c cin cout esr 1 10 100 1000 0 100 200 300 400 500 cout [f] iout [ma] unstable operation range stable operation range 0.001 0.01 0.1 1 10 100 0 100 200 300 400 500 esr [ ? ] iout ? [ma] unstable operation range stable operation range figure 41. esr vs. iout figure 42. cout vs. iout condition: vcc = 13.5 v (ctl = 5 v) cin = 0.1 f -40 c tj +150 c condition: vcc = 13.5 v (ctl = 5 v) cin = 0.1 f 10 f cout (typ.) -40 c tj +150c figure 43. measurement setups for esr reference data (about output pin capacitor) downloaded from: http:///
datasheet d a t a s h e e t 25/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series power dissipation to252-j5 / to252-3 ic mounted on rohm standard board based on jedec. : 1-layer pcb (copper foil area on t he reverse side of pcb: 0 mm 0 mm) board material: fr4 board size: 114.3mm 76.2mm 1.57 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended f ootprint + wiring to measure, 2 oz. copper. : 4-layer pcb (copper foil area on the reverse side of pcb: 74.2mm 74.2mm) board material: fr4 board size: 114.3mm 76.2mm 1.60 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended f ootprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of pcb: 74.2 mm 74.2 mm, 1 oz. copper. copper foil area on the reverse side of pcb: 74.2 mm 74.2 mm, 2 oz. copper. condition : ja = 136 c/w jt (top center) = 17 c/w condition : ja = 23 c/w jt (top center) = 3 c/w figure 44. package data (to252-j5 / to252-3) to263-5 / to263-3 ic mounted on rohm standard board based on jedec. : 1-layer pcb (copper foil area on t he reverse side of pcb: 0 mm 0 mm) board material: fr4 board size: 114.3mm 76.2mm 1.57 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended f ootprint + wiring to measure, 2 oz. copper. : 4-layer pcb (copper foil area on the reverse side of pcb: 74.2mm 74.2mm) board material: fr4 board size: 114.3mm 76.2mm 1.60 mmt mount condition: pcb and exposed pad are soldered. top copper foil: rohm recommended f ootprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of pcb: 74.2 mm 74.2 mm, 1 oz. copper. copper foil area on the reverse side of pcb: 74.2 mm 74.2 mm, 2 oz. copper. condition : ja = 81 c/w jt (top center) = 8 c/w condition : ja = 21 c/w jt (top center) = 2 c/w figure 45. package data (to263-5 / to263-3) 5.9 w 1.5 w 0 2 4 6 8 10 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd [w] ambient temperature: ta [c] 5.4 w 0.9 w 0 2 4 6 8 10 0 25 50 75 100 125 150 power dissipation: pd [w] ambient temperature: ta [c] downloaded from: http:///
datasheet d a t a s h e e t 26/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series thermal design this product exposes a frame on the back side of the package for thermal efficiency improvement. within this ic, the power consumption is decided by the dropout voltage condition, the load cu rrent and the circuit current. refer to power dissipation curves illustrated in figure 44, 45 when using the ic in an environment of ta 25 c. even if the ambient temperature ta is at 25 c, depending on the input voltage and the load current, chip junction temperature can be very high. consider the design to be tj tjmax = 150 in all possible operating temperature range. should by any condition the maximum junction temperature tjmax = 150 rating be exceeded by the temperature increase of the chip, it may result in deter ioration of the properties of the chip. t he thermal impedance in this specification is based on recommended pcb and measurement condition by jedec standard. verify the application and allow sufficient margins in the thermal design by the following met hod is used to calculate the junction temperature tj. tj can be calculated by either of the two following methods. 1. the following method is used to ca lculate the junction temperature tj. tj = ta + p c ja tj : junction temperature ta : ambient temperature p c : power consumption ja : thermal impedance (junction to ambient) 2. the following method is also used to calculate the junction temperature tj. tj = t t + p c jt tj : junction temperature t t : top center of cases (mold) temperature p c : power consumption jt : thermal impedance (junction to top center of case) the following method is used to calculate the power consumption pc (w). pc = (vcc - vout) iout + vcc icc p c : power consumption vcc : input voltage vout : output voltage iout : load current icc : circuit current downloaded from: http:///
datasheet d a t a s h e e t 27/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series ? calculation example(to252-j5 / to252-3) if vcc = 13.5 v, vout = 5.0 v, iout = 200 ma, icc = 38 a, the power consumption pc can be calculated as follows: p c = (vcc - vout) iout + vcc icc = (13.5 v C 5.0 v) 200 ma + 13.5 v 38 a = 1.7 w at the ambient temperature tamax = 85c, the thermal impedance ( junction to ambient ) ja = 23 c / w( 4-layer pcb ), tj = tamax + p c ja = 85 c + 1.7 w 23 c / w = 124.1 c when operating the ic, the top center of cases (mold) temperature t t = 100 jt = 17 c / w( 1-layer pcb ), tj = t t + p c jt = 100 c + 1.7 w 17 c / w = 128.9 c for optimum thermal performance, it is recommended to expa nd the copper foil area of t he board, increasing the layer and thermal via between thermal land pad. ? calculation example (to263-5 / to263-3) if vcc = 13.5 v, vout = 5.0 v, iout = 200 ma, icc = 38 a, the power consumption pc can be calculated as follows: p c = (vcc - vout) iout + vcc icc = (13.5 v C 5.0 v) 200 ma + 13.5 v 38 a = 1.7 w at the ambient temperature tamax = 85c, t he thermal impedance ( junction to ambient ) ja = 21 c / w( 4-layer pcb ), tj = tamax + p c ja = 85 c + 1.7 w 21 c / w = 120.7 c when operating the ic, the top cent er of cases (mold) temperature t t = 100 jt = 8 c / w( 1-layer pcb ), tj = t t + p c jt = 100 c + 1.7 w 8 c / w = 113.6 c for optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. downloaded from: http:///
datasheet d a t a s h e e t 28/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series application examples ? applying positive surge to the vcc if the possibility exists that surges higher than 45 v will be applied to the vcc, a zener diode should be placed between the vcc and the gnd as shown in the figure below. figure 46. sample application circuit 1 ? applying negative surge to the vcc if the possibility exists that negative surges lower than the gnd are applied to the vcc, a schottky diode should be place between the vcc and the pin as shown in the figure below. figure 47. sample application circuit 2 ? implementing a protection diode if the possibility exists that a large inductive load is connected to the output pin resulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. figure 48. sample application circuit 3 i/o equivalence circuit figure 49. input / output equivalence circuit cout cin iout 1: vcc 2: n.c. 3: vout fin xxmfp- battery zener diode vout fin 2:gnd bd4xxm5fp2-c 1:vcc 3:vout cout cin battery iout vout zener diode 1:vcc 3:gnd 5:vout 2:ctl 4:n.c. fin bd4xxm5wfp2-c cin battery cout input switch vout shottky diode iout cout cin iout 1: vcc 2: n.c. 3: vout fin xxmfp- battery shottky diode vout fin 2:gnd bd4xxm5fp2-c 1:vcc 3:vout cout cin battery iout vout shottky diode 1:vcc 3:gnd 5:vout 2:ctl 4:n.c. fin bd4xxm5wfp2-c cin battery cout input switch vout zener diode iout downloaded from: http:///
datasheet d a t a s h e e t 29/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series operational notes 1) absolute ma ximum ratings exceeding the absolute maximum rating for supply voltage, oper ating temperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossi ble to determine the cause of the damage (e.g. short circuit, open circuit, etc.). t herefore, if any special mode is being c onsidered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified. 3) gnd electric potential keep the gnd potential at t he lowest (minimum) level under any operati ng condition. furthermore, ensure that, including the transient, none of the pins voltage is less than the gnd voltage. 4) gnd wiring pattern when both a small-signal gnd and a high cu rrent gnd are present, single-point grounding (at the set standard point) is recommended. this in order to separate the small-signal an d high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component gnd. 5) ctl do not make voltage level of chip enab le keep floating level, or in between vt hh and vthl. otherwise, the output voltage would be unstable or indefinite. 6) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction an d position are correct. incorre ct mounting may result in damaging the ic. also, shorts caused by dust entering between the output, i nput and the gnd may result in damaging the ic. 7) inspection using the set board the ic needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8) thermal design the power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the revers e side of the package this product has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of t he pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, when actually usi ng the chip, ensure that the g enerated heat does not exceed the pd rating. should by any condition the maximum junction temperature tjmax = 150 rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. the thermal impedance in this specification is based on recommended pcb and measurement condition by je dec standard. verify the application and allow sufficient margins in the thermal design. 9) overcurrent protection circuit this ic incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. this protection circuit is effective in prev enting damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 10) thermal shut down (tsd) this ic incorporates and integrated thermal shutdown circ uit to prevent heat damage to t he ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued pe riod, the junction temperature (tj) will rise and the tsd circuit will be activated and turn a ll output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. downloaded from: http:///
datasheet d a t a s h e e t 30/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series 11) in some applications, the vcc and the vo ut potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, the accumulated charge in the output pin capacitor flowing backward from the vout to the vcc when the vcc shorts to the gnd. in order to minimize the dam age in such case, use a capacitor with a capacitance less than 1000 f. also by inserting a reverse polarity diode in series to the vcc, it can prevent reverse current from reverse battery connection or the case. when the point a is short-circuit ed gnd, if there may be any possible case point b is short-circuited to gnd, we al so recommend using a bypass diode between the vcc and the vout. figure 50. recommend example of using diodes 12) this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with t he n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when the gnd > pin a for the resistor, or the gnd > pin b for the transistor. also, when the gnd > pin b for the trans istor (npn), the parasitic diode described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic . their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd. figure 51. example of parasitic element device vcc vo gnd a b bypass diode reverse polarity diode downloaded from: http:///
datasheet d a t a s h e e t 31/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series physical dimension, tape and reel information package name to252-j5 downloaded from: http:///
datasheet d a t a s h e e t 32/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series package name to263-5 downloaded from: http:///
datasheet d a t a s h e e t 33/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series package name to252-3 downloaded from: http:///
datasheet d a t a s h e e t 34/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series package name to263-3 downloaded from: http:///
datasheet d a t a s h e e t 35/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series marking diagrams (top view) part number marking output voltage [v] enable input (1) part number marking output voltage [v] enable input (1) 433m5w 3.3 ? 433m5w 3.3 ? 450m5w 5.0 ? 450m5w 5.0 ? part number marking output voltage [v] enable input (1) part number marking output voltage [v] enable input (1) 433m5 3.3 C 433m5 3.3 C 450m5 5.0 C 450m5 5.0 C to252-j5 (top view) part number marking lot number 1pin to252-3 (top view) part number marking lot number to263-5 (top view) part number marking lot number 1pin (1) : includes enable input C : not includes enable input to263-3 (top view) part number marking lot number 1pin (1) : includes enable input C : not includes enable input (1) : includes enable input C : not includes enable input (1) : includes enable input C : not includes enable input downloaded from: http:///
datasheet d a t a s h e e t 36/36 tsz02201-0g1g0an00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 23.may.2016 rev.005 www.rohm.com tsz22111 ? 15 ? 001 bd4xxm5-c series revision history date revision changes 5.apr.2013 001 new release 18.oct.2013 002 general description and key specifications revised. figure 1. fp2: to263-5f h (max.) revised. pin no. fin of bd433 / 450m5wfpj-c and bd433 / 450m5wfp2-c revised. figure 4. block diagrams (bd433 / 450m5wfpj-c, bd433 / 450m5wfp2-c, bd433 / 450m5fp-c, bd433 / 450m5fp2-c) revised. physical dimension(to252-j5f), tape and reel information (to263-5f, to263-3f) revised. 01.oct.2014 003 key specifications is revised to features. calculation example figure no . of output current max. about to252-3, to263-5f, to263-3f revised. tape and reel information (to263-5f, to263-3f) revised. 04.feb.2015 004 names of pkg revised. description of thermal impedance (to252-j5 , to252-3, to263-5, to263-3) revised. 2016.05.23 005 names of ordering in formation revised. title of figure 45 revised. copper foil area on the reverse side of pcb revised. aec-q100 (note1:grade1) appended. downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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